Sense amp circuit, and semiconductor memory device using the same

ABSTRACT

A differential input circuit receives differential input signals at a pair of differential input terminals and produces a pair of first differential output signals. A sensing circuit senses at least one of the pair of first differential output signals reaching a certain voltage and provides an activation signal. A latch-type amplifier provides a pair of second differential output signals when activated in accordance with the activation signal. A cutoff circuit establishes connection between the differential input circuit and the latch-type amplifier and breaks connection between the differential input circuit and the latch-type amplifier in accordance with the activation signal.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 12/040,297,filed Feb. 29, 2008, now U.S. Pat. No. 7,590,018, issued on Sep. 15,2009, which is based upon and claims the benefit of priority from priorJapanese Patent Application No. 2007-51203, filed on Mar. 1, 2007, theentire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a sense amp circuit and a semiconductormemory device using the same. In more detail, it relates to a sense ampcircuit suitably applicable in a semiconductor memory device that usesan antifuse element of the gate insulator destruction type in a memorycell, and to a semiconductor memory device.

2. Description of the Related Art

In a recent large capacity semiconductor memory device, a relativelysmall capacity, nonvolatile memory device is mounted in combination onthe same chip to store an address of a failed memory element contained.Similarly, also in a high-function, high-speed semiconductor logiccircuit device, a relatively small capacity, nonvolatile memory elementis mounted in combination for the purpose of holding productioninformation and of storing an individual chip intrinsic number.Similarly, also in a high-precision analog circuit device, a relativelysmall capacity, semiconductor memory device is mounted in combination aswell to store adjustment information for keeping the characteristicuniform.

As the semiconductor memory device employed in the above use, asemiconductor memory element called antifuse element operative to store1-bit data by destroying a gate insulator of a MOS transistor is used,as found in examples. (See, for example, H. Ito et al., “Pure CMOSOne-time Programmable Memory using Gate-OX Antifuse”, Proceedings of theIEEE 2004 Custom Integrated Circuits Conference, PP. 469-472.) Theantifuse element of the gate insulator destruction type is characterizedin that it can be produced inexpensive without the need for anyadditional production step to the production thereof. Furthermore, sinceit is characterized in that it does not need any additional productionstep, it does not suffer from any deterioration of properties of majorsemiconductor elements mounted in combination on the same chip, such asfine-patterned memory elements for large capacity storage, high-speedtransistors contained in high-speed logic circuits, and transistors foranalog circuits exhibiting a high-precision electrical property. Withthese excellent characteristics, the antifuse element may be referred toas an optimal nonvolatile memory element for the above use.

A nonreversible memory element, such as the antifuse element, capable ofholding data by destroying the internal structure or the composition ofthe constitutional substances may often be not excellent in readingelectrical property. For example, the change in the amount of readcurrent in accordance with the change in state is small, or theassociated variation is large, or application of an appropriate voltageis required to obtain as large read current as some extent. Configuringa semiconductor memory device with such the memory element not excellentin reading electrical property can not lack the use of a high-precisionsense amp that applies an appropriate bias voltage, accurately amplifiesa very small read-out potential difference, and decides “0”/“1” ofoutput data at appropriate timing.

Conventionally used high-precision sense amps operative to amplify avery small differential potential difference include a differentialamplifier of the analog operation type. In general, an analogdifferential amplifier has advantages because a higher amplificationrate can be set and a high-precision sense amp can be designed easily.To the contrary, the differential amplifier of the analog operation typehas disadvantages because it consumes larger power and has a largerlayout area.

On the other hand, the sense amp including the latch circuit hasadvantages because it has a simpler configuration and a smaller layoutarea, operates under a lower voltage, and consumes smaller power sincecurrent flows only at the instant of sensing. To the contrary, it hasdisadvantages because it has a lower amplification rate and a lowerprecision in comparison with the sense amp including the analogdifferential amplifier.

SUMMARY OF THE INVENTION

In one aspect the present invention provides a sense amp circuit,comprising: a differential input circuit operative to receivedifferential input signals at a pair of differential input terminals andproduce a pair of first differential output signals; a sensing circuitoperative to sense at least one of the pair of first differential outputsignals reaching a certain voltage and provide an activation signal; alatch-type amplifier operative to provide a pair of second differentialoutput signals when activated in accordance with the activation signal;and a cutoff circuit operative to establish connection between thedifferential input circuit and the latch-type amplifier and breakconnection between the differential input circuit and the latch-typeamplifier in accordance with the activation signal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram showing a brief configuration of a sense ampcircuit according to a first embodiment of the present invention.

FIG. 2 is a circuit diagram showing a specific configuration example ofthe circuit in FIG. 1.

FIG. 3 is a timing chart illustrative of operation of the sense ampcircuit in the first embodiment.

FIG. 4 is a timing chart illustrative of operation of the sense ampcircuit in the first embodiment.

FIG. 5 is a timing chart illustrative of operation of the sense ampcircuit in the first embodiment.

FIG. 6 is a block diagram showing a brief configuration of a sense ampcircuit according to a second embodiment of the present invention.

FIG. 7 shows a specific configuration example of a memory cell 1 in FIG.6.

FIG. 8 shows a specific configuration example of a sense amp circuit 10in FIG. 6.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The embodiments of the present invention will now be described in detailwith reference to the drawings.

FIG. 1 is a block diagram showing a brief configuration of a sense ampcircuit according to a first embodiment of the present invention. Thesense amp circuit of the first embodiment contains an automatic latchfunction, as obvious from the following description.

The sense amp circuit comprises a differential input circuit 1, aconnection cutoff unit 2, a latch-type amplifier 3, an initializingcircuit 4, and an operation detecting circuit 5.

The differential input circuit 1 is an analog differential amplifieroperative to receive differential input signals PLUS and MINUS at a pairof differential input terminals. It differentially amplifies thedifferential input signals PLUS and MINUS to provide differential outputsignals DP and DM. One of the differential input signals PLUS and MINUSis a signal based on cell current read from a selected memory cell andthe other is a signal based on a reference potential given from areference potential generator circuit.

The differential input circuit 1 is activated on receipt of anactivation signal SAE and enabled to operate in accordance with aninitializing signal INIT.

When the activation signal SAE is in a certain state, the differentialinput circuit 1 operates such that the output signal DP is turned to ahigher potential than DM if the input signal PLUS is higher in potentialthan the input signal MINUS. In other cases, the output signal DM isturned to a higher potential than DP to the contrary.

The connection cutoff unit 2 is arranged in signal lines that connectthe differential input circuit 1 with the latch-type amplifier 3 toestablish connection between both. The connection cutoff unit 2 has afunction of breaking the signal lines on receipt of a later-describedactivation signal AMPE at certain timing. The connection cutoff unit 2has an amplifying function and can be configured such that it amplifiesthe output signals DP and DM from the differential input circuit 1 toprovide amplified differential output signals SP and SM.

The latch-type amplifier 3 is a differential amplifier of the latchtype, which receives the output signals SP and SM from the connectioncutoff unit 2 and differentially amplifies them to provide adifferential output signal OUT as a result of the differentialamplification. The latch-type amplifier 3 starts the above-describeddifferential amplification when it is activated by the output of thelater-described activation signal AMPE at certain timing.

The initializing circuit 4 receives the activation signal SAE and setsoutput terminals of the differential input circuit 1 at an initialpotential (the ground potential Vss) when the activation signal SAE isin a first state. Thereafter, when the activation signal SAE turns to asecond state, the initializing circuit 4 provides the initializingsignal INIT that enables the differential input circuit 1 to startoperation. The initializing signal INIT is fed to the differential inputcircuit 1 and the connection cutoff unit 2.

The operation detecting circuit 5 receives the output signals DP and DMfrom the differential input circuit 1 and, on detection of either one ofthe signals exceeding a certain voltage, provides the activation signalAMPE that causes the connection cutoff unit 2 to break connection andactivates the latch-type amplifier 3.

FIG. 2 shows a specific configuration example of the circuit in FIG. 1.

In this example, the differential input circuit 1 includes p-type MOStransistors 11-13. The p-type MOS transistor 11 has a source connectedto a supply voltage, and a drain connected to sources of the p-type MOStransistors 12, 13. With this configuration, the p-type MOS transistor11 serves as a constant current source transistor, which is turned on tosupply drive current to the transistors 12, 13 while a negative logicactivation signal SAEn is at “L”. The p-type MOS transistors 12, 13configure a pair of differential input gate transistors, which receivethe differential input signals PLUS, MINUS at respective gates andprovide the differential output signals DP, DM from respective drains.

The connection cutoff unit 2 includes a pair of n-type MOS transistors21, 22. The n-type MOS transistors 21, 22 are turned off when a negativelogic activation signal AMPEn is made “L” to isolate the differentialinput circuit 1 from the latch-type amplifier 3. While the activationsignal AMPEn is at “H”, it serves as a source follower circuit, whichreceives the differential output signals DP, DM at drains and providesthe slightly amplified differential output signals SP, SM.

The latch-type amplifier 3 includes n-type MOS transistors 31, 32 andp-type MOS transistors 33-36.

The n-type MOS transistors 31, 32 have gates connected cross torespective drains, and sources commonly connected to the groundpotential to form an n-type latch circuit. The p-type MOS transistors33,34 are connected between the transistors 35 and 31 and between thetransistors 36 and 32, respectively. When the activation signal AMPEngiven to the gates is made “L”, the p-type MOS transistors 33,34 areturned on to activate the latch-type amplifier 3.

The p-type MOS transistors 35,36 have sources commonly connected to thesupply voltage, drains connected to the p-type MOS transistors 33,34,and gates connected cross to the drains of the n-type MOS transistors32, 31. Thus, the p-type MOS transistors 35,36 configure a p-type latchcircuit. In this example, the drain of the n-type MOS transistor 31 isused as an output node for the output signal OUT. The n-type MOStransistors 31, 32 receive at the drains the output signals SP and SMfrom the connection cutoff unit 2. This circuit is configured to receivethe input signal SP from the latch-type amplifier 3 and provide theassociated output signal OUT to external at an identical node.

The initializing circuit 4 includes four n-type MOS transistors 41, 42,43, 44. The four n-type MOS transistors 41, 42, 43, 44 have sourcescommonly connected to the ground potential, and drains respectivelyconnected to the output terminals of the differential output signals DP,SP, SM, DM.

The four MOS transistors 41, 42, 43, 44 have gates connected to theactivation signal SAEn. Namely, while the activation signal SAEn is keptat “H”, the four MOS transistors 41, 42, 43, 44 are turned on to executeinitializing operation to give the ground potential on the sources tothe output terminals of the differential output signals DP, SP, SM, DM.(This operation to give the ground potential corresponds to the outputof the above initializing signal INIT.) When the activation signal SAEnis turned to “L”, it terminates the initializing operation.

The operation detecting circuit 5 includes a NOR logic circuit havingtwo input terminals. The paired input terminals are connected to thepaired output signals DP and DM from the differential input circuit 1,respectively. The NOR logic circuit has an output terminal, from whichthe negative logic activation signal AMPEn is provided to external. TheNOR logic circuit operates under the supply voltage also supplied to thedifferential input circuit 1 and so forth to switch the activationsignal AMPEn to “L” when the output signal DP or DM reaches aroundone-half of the supply voltage.

Operation of the sense amp circuit shown in FIG. 2 is described nextusing the timing charts of FIGS. 3, 4 and 5.

First, while the sense amp circuit is in a pre-operation state (onstandby: before time T2), the activation signal SAEn at “H” keeps thedifferential input circuit 1 inactive. Thereafter, when the activationsignal SAEn turns to “L” at time T2, it activates the differential inputcircuit 1.

At previous time T0, the input signals PLUS and MINUS are initialized toa potential of 0 V by an equalizing circuit, not shown. At this time,the negative logic activation signal SAEn is kept at “H” and, under thecontrol thereof, the initializing circuit 4 operates to initialize allthe internal signals DP, DM, SP (OUT), SM in the sense amp to 0 V.

Next, the equalizing circuit (not shown) terminates equalizing at timeT1, and memory cells, not shown, are connected to the terminal of thesignal PLUS on the differential input circuit 1. Then, a very small readcurrent flowing in a “1” holding data memory cell starts charging aparasitic capacitor associated with the terminal of the signal PLUS. Inaddition, the terminal of the signal MINUS on the differential inputcircuit 1 is similarly connected to a reference voltage generatorcircuit, not shown. While this condition is retained, the potential ofone input signal PLUS from the differential input circuit 1 becomesaround 100 mV and the potential of the other input signal MINUS around50 mV at time T2. In a word, the very small read current flowing in thememory cell holding “1” data causes a very small potential differenceof, for example, about 50 mV between the PLUS signal and the MINUSsignal.

When the activation signal SAEn is kept at “H”, the initializing circuit4 receives it and initializes the output terminals of the output signalsDP, DM, SP, SM (to 0 V). At this time, on receipt of the differentialoutput signals DP and DM kept at the initial potential, the operationdetecting circuit 5 senses the differential input circuit 1 beinginactive and turns the activation signal AMPEn to “H”. The connectioncutoff unit 2 receives the activation signal AMPEn=“H” and retainsconnection between the differential input circuit 1 and the latch-typeamplifier 3.

On receipt of the activation signal AMPEn=“H” at the gates of the p-typeMOS transistors 33, 34, the latch-type amplifier 3 becomes inactive andleaves the output signal OUT at “L”. This standby state is also apreparation stage for sensing as described subsequently and a low-powerconsumption state at the same time because the differential inputcircuit 1 and the latch-type amplifier 3 are suppressed to operate.

Next, prior to the activation of the differential input circuit 1 (timeT2), a standby time is provided until the states of the differentialinput signals PLUS and MINUS are fixed. In the case shown in FIG. 1, theformer is higher than the latter (in reading “1” data). If thedifferential input circuit 1 is activated in an initial state with nopotential difference between the differential input signals PLUS andMINUS or in an incorrect state with an inverse potential relation, thedifferential input circuit 1 may amplify the abnormal state and providean abnormal result possibly (An output signal OUT different from thedata to be read out is obtained). If the abnormal result is output, andthen the latch-type amplifier 3 once latches the abnormal state, theoutput signal OUT cannot make a transition to a correct result again.This situation is not improved if the differential input signals PLUSand MINUS might make a transition to a correct state after the output ofthe abnormal result. Therefore, prior to the activation of thedifferential input circuit 1 (time T2), the states of the differentialinput signals PLUS and MINUS should be fixed.

Next, when the activation signal SAEn falls down to “L”, it activatesthe differential input circuit 1 and turns off the n-type MOStransistors 41-44 in the initializing circuit 4. (Namely, theinitializing circuit 4 terminates initializing the output signals DP,DM, SP, SM.) Namely, the p-type MOS transistor 11 serving as theconstant current source in the differential input circuit 1 turns on andstarts supplying current to the p-type MOS transistors 12 and 13.

At this time, if the input signal PLUS is slightly higher than MINUS,the current flowing in the transistor 12 becomes larger than the currentflowing in the transistor 13. As a result, the potential of the signalDP rises faster than the potential of the signal DM. Thus, a potentialdifference starts growing between the output signals DM, DP in responseto the potential difference between the differential input signals PLUS,MINUS. At this time, as the connection cutoff unit 2 has been turned offyet, the potentials of the output signals SP and SM also riseaccordingly. As the output signal SP is also the output signal OUT, theoutput signal OUT also rises accordingly.

The potential difference between the differential output signals DP andDM becomes larger than the potential difference between the differentialinput signals PLUS and MINUS through the action of amplifying by thedifferential input circuit 1. The connection cutoff unit 2 also has afunction of amplifying such that the potential difference caused betweenthe differential output signals SP and SM becomes slightly larger thanthe potential difference between the differential output signals DP andDM.

Namely, the n-type MOS transistors 21, 22 contained in the connectioncutoff unit 2 are used as source followers. Accordingly, the outputsignals SP and SM respectively follow the input signals DP and DM whilethe input signals DP and DM are still at lower potentials. As the inputsignals DP and DM make transitions to higher potentials, however, theconnection has a higher resistance, which starts dissociation betweenthe output signal SP and the input signal DP and between the outputsignal SM and the input signal DM. The output signals SP and SM from theconnection cutoff unit 2 are connected to the paired n-type MOStransistors 31 and 32 contained in the latch-type amplifier 3. Thetransistors 31, 32 serving as loads yield the action of amplifying inthe connection cutoff unit 2 such that the potential difference betweenthe output signals SP and SM becomes larger than that the potentialdifference between the input signals DP and DM.

The operation detecting circuit 5 senses whether or not the potential ofat least one of the output signals DP and DM is higher than, forexample, one-half of the supply voltage. In the sense amp circuit ofthis embodiment, the potential measurement accuracy of the operationdetecting circuit 5 itself is not important. Rather, the operationalcharacteristic of the differential input circuit 1 as the analogdifferential amplifier circuit is important. If the differential inputcircuit 1 is optimized, it can be regarded that, by sensing thepotential of either one of the output signals DP and DM reaching aroundone-half of the supply voltage, a sufficiently large potentialdifference is caused between the output signals DP and DM. Therefore, aNOR logic circuit comprising a CMOS circuit may be available as theoperation detecting circuit 5. This NOR logic circuit provides theactivation signal AMPEn=“L” when it senses at least one of the outputsignals DP, DM reaching around one-half of the supply voltage (time T3).

On receipt of the activation signal AMPEn=“L” output from the operationdetecting circuit 5 at time T3, the connection cutoff unit 2 breaksconnection between the differential input circuit 1 and the latch-typeamplifier 3. Thus, the output terminals of the differential outputsignals DP and DM and the differential output signals SP and SM arebrought into high-impedance states.

At the same time, on receipt of the activation signal AMPEn=“L”, thelatch-type amplifier 3 is activated. At this time, at least one of theoutput signals SP and SM is amplified up to around one-half of thesupply voltage or higher. Accordingly, even a low-amplification abilitylatch-type amplifier can amplify the potential difference caused betweenthe output signals SP and SM up to the supply voltage to provide theoutput signal OUT. At this time, the connection cutoff unit 2 isolatesthe differential input circuit 1 or analog amplifier from the latch-typeamplifier 3 to suppress power consumption.

Finally, when the activation signal SAEn is returned again to “H” attime T4, the differential input circuit 1 terminates sensing and becomesstandby and the initializing circuit 4 initializes the signals DP, DM,SP, SM. The output signal OUT is also turned again to “L” though theoutput signal OUT can be retained in a latch circuit (not shown)operative to latch the output signal OUT using the activation signalSAEn as a trigger signal.

As described above, in this embodiment, the differential input circuit 1or analog amplifier and the connection cutoff unit 2 amplify thedifferential input signals PLUS and MINUS to obtain the amplifieddifferential output signals DP, DM, SP, SM. When the operation detectingcircuit 5 senses that the differential output signals DP, DM areamplified to some extent, the latch-type amplifier 3 is activated andthe differential input circuit 1 is isolated therefrom by the connectioncutoff unit 2. Optimization of device constants of the differentialinput circuit 1 and the connection cutoff unit 2 enables an improvementin sensing accuracy and an improvement in sensing speed to be satisfiedat the same time. In addition, even if the current flowing in thedifferential input circuit 1 is enhanced, the connection cutoff unit 2can suppress the period of time of operation of the differential inputcircuit 1 as short as possible. Accordingly, power consumption in theentire sense amp can be rather reduced.

Also in this embodiment, operation of the latch-type amplifier 3 isstarted when the output signals DP, DM from the differential inputcircuit 1 are amplified up to around one-half of the supply voltage.This is effective to prevent the latch-type amplifier 3 from erroneouslysensing. This point is described with reference to FIG. 4. FIG. 4 showsoperation when the differential output signals PLUS, MINUS are smallerthan those in FIG. 3.

If the differential input signals PLUS, MINUS are very small at time T2,the potential difference caused between the output signals DP and DMfrom the differential input circuit 1 also becomes small (the voltagerises slowly). Similarly, the potential difference caused between theoutput signals SP and SM from the connection cutoff unit 2 also becomessmall (the voltage rises slowly).

If the latch-type amplifier 3 starts operation at the same timing as inFIG. 2 or time T3′, the potential difference between the input signalsSP and SM is too small. Accordingly, an influence of the offset in thelatch-type amplifier 3 may cause erroneous sensing of data at a highrisk.

In the present embodiment, however, the operation detecting circuit 5works such that the time T3 of activation of the latch-type amplifier 3is delayed until the output signal DP or DM from the differential inputcircuit 1 reaches around one-half of the supply voltage. If thelatch-type amplifier 3 is activated at this timing, a sufficientpotential difference is caused between the input signals SP and SM tothe latch-type amplifier 3. Accordingly, the risk of erroneous sensingof data can be reduced even if the latch-type amplifier 3 contains moreor less offset.

Further, in accordance with the present embodiment, a high-precisionsense amp circuit can be configured easily. Realization of ahigh-precision sense amp requires effective measures including: settinga smaller amount of current flowing through the p-type MOS transistor 11or the constant current source in the differential input circuit 1 thanthe current drive ability of the p-type MOS transistors 12, 13; settinga longer channel length L such that the p-type MOS transistors 12, 13operate in the pentode region; and setting a larger gate area to achievematched device properties of the p-type MOS transistors 12, 13.

Similarly, it is effective to set a larger gate area to achieve matcheddevice properties of the n-type MOS transistors 21 and 22 contained inthe connection cutoff unit 2 and the n-type MOS transistors 31 and 32contained in the latch-type amplifier 3. It is also effective to set alarger channel width W of these transistors to enhance the current driveability of the device.

Also in accordance with the present embodiment, the sensing speed can beeasily set higher. For that purpose, it is effective to set a largerchannel width W of the p-type MOS transistor 11 or the constant currentsource to increase the value of current flowing in the differentialinput circuit 1. It is also effective to set a larger channel width W ofthe p-type MOS transistors 12, 13 to increase the current drive abilityof the device and a smaller channel length L to reduce the parasiticcapacity.

Similarly, as for the n-type MOS transistors 21 and 22 contained in theconnection cutoff unit 2 and the n-type MOS transistors 31 and 32contained in the latch-type amplifier 3, it is effective to set asmaller channel length L and a smaller channel width W to reduce theparasitic capacity so long as the balance can be kept between thecurrent drive ability of the transistors and the value of currentflowing through the constant current source 11.

Thus, through adjustment of the device constants of the transistorscontained in the differential input circuit 1, the connection cutoffunit 2 and the latch-type amplifier 3, the required sensing accuracy andsensing speed can be realized. Tradeoffs may arise among some itemsthough the required sensing accuracy and sensing speed can be satisfiedat the same time in many cases if an increase in current consumption andan increase in layout area are allowed. Even if the current flowing inthe differential input circuit 1 is enhanced, the power consumed in theentire sense amp can be rather reduced because the differential inputcircuit 1 is allowed to operate within a minimum period of time.

FIGS. 3 and 4 show operational waveforms on reading the memory cellholding “1” data. Referring next to FIG. 5 showing operational waveformson reading a memory cell holding “0” data, the effect of the presentembodiment is described.

In FIG. 5, the memory cell holding “0” data is selected. Therefore, theread current is extremely small, and the potential of the differentialinput signal PLUS at time T2 becomes a lower potential than thedifferential input signal MINUS used as the reference potential. If thedifferential input circuit 1 starts operation in this condition, as forthe differential output signals DP and DM, the latter has a higherpotential, and as for the differential output signals SP and SM, thelatter has a higher potential similarly.

A problem arises herein on the following phenomenon if the memory cellholding “0” data is selected and the selected condition is keptunchanged for a longer period of time. Namely, in this case, thepotential of the input signal PLUS connected to that memory cell becomesfloated and loses the potential difference from the input signal MINUSbased on the reference power source, and finally results in an invertedpotential relation (around time T4 in FIG. 5). Ideally, if the memorycell holding “0” data is selected, the read current is very small.Therefore, the potential of the input PLUS signal based thereon isexpected to continuously stay at the initial state of 0 V. In practice,however, very small leakage current and noises from other circuitsinfluence, and the potential of the input signal PLUS becomes floatedafter left for a longer period of time. Prevention of erroneous sensingof “0” data due to the influence of this phenomenon requires terminationof sensing as soon as possible after the beginning of sensing to fix theoutput signal OUT. In a word, it is required to advance the time T3 ofbeginning operation of the latch-type amplifier 3.

As described in FIG. 4, however, on reading from the memory cell holding“1” data, only a very small potential difference may be caused betweenthe differential input signals PLUS and MINUS if the concerned memorycell has no excellent electrical property. In this case, advancing thetime T3 of beginning operation of the latch-type amplifier 3 leads toerroneous sensing of data.

In the sense amp circuit of the present embodiment, however, theoperation detecting circuit 5 starts operation of the latch-typeamplifier 3 at an appropriate time in accordance with each operationalcondition. With this configuration, depending on the read data being “0”data or “1” data, and in accordance with the read current being large orsmall, it is possible to start operation of the latch-type amplifier 3at an appropriate time, and isolate the differential input circuit 1 bythe connection cutoff unit 2. Therefore, the present embodiment canprovide a high-speed, high-precision and low-power consumption sense ampcircuit.

Second Embodiment

FIG. 6 shows a configuration of the major part of a nonvolatilesemiconductor device according to a second embodiment of the presentinvention. The present embodiment relates to a nonvolatile semiconductormemory device using a sense amp circuit 10 with an automatic latchingfunction.

In the present embodiment, a memory cell array 7 comprises memory cells6 arranged in grid.

A memory cell 6 is connected to a word line WL, a write signal line WBL,and a read signal line RBL. The memory cell 6 is provided with a plateelectrode for applying a high voltage of around 6 V on writing and a lowvoltage of around 1 V on reading, which is though not a majorconstituent and accordingly not shown in the figure.

In the memory cell array 7, the memory cells 6 arranged in row are eachcommonly connected to row selection lines WLp<0-7>. The row selectionlines WLp<0-7> are driven by a row decoder 8 and selectively activatedby a row address RA<2:0> given to the row decoder 8.

On the other hand, the memory cells 6 arranged in column are eachcommonly connected to write bit lines WBLn<0-7>. The write bit linesWBLn<0-7> are driven with respective write buffers 9.

In parallel with the write bit lines WBLn<0-7>, paired read bit linesRBLt<0-7> and RBLc<0-7> are provided. One-half of the memory cells 6arranged in column are commonly connected to true read bit linesRBLt<0-7> and the remaining half of the memory cells 6 similarlyarranged in column are commonly connected to complement read bit linesRBLc<0-7>.

The paired read bit lines RBLt<0-7> and RBLc<0-7> are connected to trueinput terminals (+) and complementary input terminals (−) on respectiveread sense amps 10. The outputs of the read sense amps 10 and the inputsof the above write buffers 9 are connected to a data buffer 11. The databuffer 11 is provided with a data output DOp and a data input DIp on theother side. The data buffer 11 is used to control exchanges of databetween the semiconductor memory device and the outside thereof.

FIG. 7 shows a configuration example of the memory cell 6. The memorycell 6 includes an antifuse element 61; a write control element 62 to beturned on at the time of writing; a barrier element 64 operative toprevent application of a high-voltage stress to a read selection element65 on writing; a write selection element 63 to be selectively turned on;and a read selection element 65 to be selectively turned on similarly.

There are various semiconductor elements available as the elements 61-65though a p-type MOS transistor is used as the antifuse element 61 andn-type MOS transistors as the other elements in the example of FIG. 7.

The antifuse element 61 has a source, a drain and a bulk electrode allshort-circuited and connected to a write power source VBP. The antifuseelement 61 has a gate insulator, which has a higher resistance under thenormal condition and a lower resistance after the gate insulator isbroken down with application of the high-voltage stress. With theutilization of this variation in electrical property, it is used as anonvolatile memory cell operative to hold “0” data under the higherresistance condition and “1” data under the lower resistance condition.

The gate electrode is connected to the write control element 62 and thebarrier element 64.

The write control element 62 has a gate connected to the write controlsignal WE, and the barrier element 64 has a gate connected to a barrierpower source VBT. The write power source VBP, the barrier power sourceVBT and the write control signal WE are commonly connected to all thememory cells 6.

The write control element 62 has a source connected to a write bit lineWBL via the write selection element 63. Similarly, the barrier element64 has a source connected to a read bit line RBL via the read selectionelement 65. The write selection element 63 and the read selectionelement 65 have respective gates both connected to a row selection lineWL.

Writing of information in the antifuse element 61 can be executedthrough the following procedural steps. First, the write power sourceVBP is brought into a high potential sufficient to breakdown the gateinsulator. At this time, the antifuse element 61 and additionally thewrite control element 62, the write selection element 63, the barrierelement 64 and the read selection element 65 are preferably protectedfrom undesired high voltage stresses applied thereto. For that purpose,the barrier power source VBT, the write control signal WE, the rowselection line WL, the write bit line WBL and the read bit line RBL aresimultaneously brought into somewhat high potentials. For example, ap-type MOS transistor usually used with a power source of 1 V is used asthe antifuse element 61, and n-type MOS transistors usually used with apower source of 3 V are used as the other control elements. In such thecase, it is appropriate to set the potential of the write power sourceVBP at 6 V and the potentials on the other terminals at 3 V.

Next, the row selection line WL connected to the write-targeted memorycell 61 is held selected at a high potential of 3 V while the other rowselection lines WL are held non-selected at a low potential of 0 V.Further, the write bit line WBL connected to the write-targeted memorycell 6 is held at a low potential of 0 V while the other write bit linesWBL are held at a high potential of 3 V. At this time, the read bitlines RBL are similarly treated, and the read bit line RBL connected tothe write-targeted memory cell 6 is held at a low potential of 0 V whilethe other read bit lines RBL are held at a high potential of 3 V.Alternatively, all the read bit lines RBL are brought intohigh-impedance states. Thus selected is the memory cell 6 connected tothe row selection line WL at a high potential and to the write bit linesWBL at a low potential.

Applied across both terminals of the memory element 61 in the selectedmemory cell 6 is a voltage of 6 V given from the power source VBP. Thisstate is continuously retained to breakdown the gate insulator of thememory element 61 in the selected memory cell 6 in the end. Thebreakdown occurs locally in the shape of a pinhole with a diameter ofaround 50 nm. Further, a high voltage is continuously applied to thisvery small breakdown spot to cause a relatively large current flow of 2mA or more. This writing changes the composition of the breakdown spotand the peripheral thereof to form a conductive path with a relativelylow resistance. Thereafter, the application of the voltage isintercepted to terminate the writing.

Reading of data from the antifuse element 61 is described next. First,all the row selection lines WL and the write control signals WE are heldat 0 V and the write power source VBP at a potential of 1 V insufficientto breakdown the gate insulator. In this state, reading is started.

At the same time, the barrier power source VBT is set at a highpotential, for example, 1.8 V to turn on the barrier element 64. Whileretaining this condition, the potential on the read bit line RBLt isinitialized to 0 V. Through the initializing, a sufficient voltage toobtain read current is applied to the antifuse element 61.

Next, the read bit line is brought into a high-impedance state or a biascurrent of around 1 μA is passed, and the row selection line WL isselectively set at a high potential, for example, 1.8 V.

In reading, the write bit line WBL may be at a low potential or at ahigh potential, for example, 1.8 V so long as the device can not bebroken down.

While this condition is retained, if the antifuse memory element 61holds “1” data, the antifuse memory element 61 has a lower resistance.Therefore, current flows in the read bit line RBLt, and the read bitline RBLt makes a transition to a high potential.

In contrast, if the antifuse memory element 61 holds “0” data, theantifuse memory element 61 has a higher resistance. Therefore, currenthardly flows in the read bit line RBLt, and the potential on the readbit line RBLt remains near the initial potential of 0 V. Thereafter, tothe read bit line RBLc paired with the read bit line RBLt connected tothe selected memory cell 6, a reference power source, not shown, isconnected to apply an intermediate potential of, for example, 0.1 Vthereto.

Thereafter, the potential difference caused between the selected readbit line RBLt and the reference read bit line is sensed at the readsense amp 10 to determine whether the data stored in the selected memorycell 6 is “0” or “1”. The result is then provided to the output terminalDop via the data buffer 11.

FIG. 8 shows a configuration example of a sense amp circuit 10 availablein the second embodiment. The sense amp circuit 10 is almost similar tothe sense amp circuit 10 shown in FIG. 2 and the same constituents aredenoted with the same reference numerals and omitted from the followingdetailed description. The paired read bit lines RBLt and RBLc areconnected to the gates of the transistors 12 and 13, respectively.

The sense amp circuit 10 comprises an equalizing circuit 112 operativeto short-circuit the paired read bit lines RBLt and RBLc to initializethem to an equalizing voltage VBLEQ. The equalizing circuit 112 includestwo n-type MOS transistors having respective gates, which receive anequalizing signal EQLp thereon.

The sense amp circuit 10 is configured to provide complementary outputsignals OUTt, OUTc from the latch-type amplifier 3. The output signalOUTt is provided from a connection node between the transistors 33 and31 and the output signal OUTc is provided from a connection node betweenthe transistors 34 and 32.

The output signals OUTt, OUTc are latched in a latch circuit 113. Thelatch circuit 113 includes two NOR circuits 201, 202 and receives theoutput signal OUTt at one input terminal of the NOR circuits 201 and theoutput signal OUTc at one input terminal of the NOR circuits 202. TheNOR circuits 201, 202 have respective output terminals eachinterconnected to the other input terminal. With this configuration, thesignals OUTt, OUTc can be latched.

The complementary output signals from the latch circuit 113 are fed to aselection switch 114. The selection switch 114 includes logic gates211-213. The logic gate 211 has one input terminal to receive the outputsignal (true or complementary) from the latch circuit 113 and the otherinput terminal to receive the least significant signal RA<0> in a rowaddress. The logic gate 212 has one input terminal to receive the outputsignal (complementary or true) from the latch circuit 113 and the otherinput terminal to receive the least significant signal RA<0> in a rowaddress. The logic gate 213 is operative to provide a logical sum ofoutput signals from the logic gates 211, 212.

The selection switch 114 provides positive logic data (datacorresponding to the latched data in the latch circuit 113) as theoutput signal Q when the least significant signal RA<0> in the rowaddress is Low, that is, a memory cell at an even address is selected.On the other hand, the selection switch 114 provides negative logic data(inverted data of the latched data in the latch circuit 113) as theoutput signal Q when the least significant signal RA<0> in the rowaddress is High, that is, a memory cell at an odd address is selected.

With this function of the selection switch 114, even if either a memorycell 1 at an even address or a memory cell 1 at an odd address isselected, and if the antifuse element 7 contained in the concernedmemory cell 1 is not programmed, the output signal Q becomes Low or 0.On the other hand, if the antifuse element 7 is programmed, the outputsignal Q becomes High or 1. In other words, in the absence of theselection switch 114, the output signal Q (the output signal from thelatch circuit 113) on reading a memory cell 1 that stores an even “1”differs from that on reading a memory cell 1 that stores an odd “1”. Inthe presence of the selection switch 114, to the contrary, such thesituation can be avoided.

The embodiments of the invention have been described above though thepresent invention is not limited to these embodiments but rather can begiven various modifications, additions and so forth without departingfrom the scope and spirit of the invention.

1. A semiconductor memory device, comprising: a memory cell array ofmemory cells arranged in a matrix; a plurality of word lines arranged insaid memory cell array to select said memory cells in a row direction; apair of read bit lines arranged in a direction orthogonal to said wordlines to read data from one of said memory cells, a first read bit linein the pair of read bit lines being provided with a signal from one ofthe memory cells when a second read bit line in the pair of read bitlines is provided with a reference potential; a single write bit linearranged in a direction orthogonal to said word lines to write data inone of said memory cells; and a sense amp operative to amplify apotential difference caused between said pair of read bit lines, whereinsaid sense amp includes a differential input circuit having a pair ofdifferential input terminals connected to said pair of read bit linesand operative to produce a pair of first differential output signals, alatch-type amplifier operative to provide a pair of second differentialoutput signals based on the pair of first differential output signals,and a cutoff circuit operative to establish connection between saiddifferential input circuit and said latch-type amplifier and breakconnection between said differential input circuit and said latch-typeamplifier.
 2. The semiconductor memory device according to claim 1,wherein said cutoff circuit includes transistors connected betweenoutput terminals of said differential input circuit and input terminalsof said latch-type amplifier.
 3. The semiconductor memory deviceaccording to claim 1, further comprising an initializing circuitoperative to keep potentials on output terminals of said differentialinput circuit at initial potentials prior to activation of saiddifferential input circuit.
 4. The semiconductor memory device accordingto claim 3, wherein said initializing circuit includes n-type MOStransistors connected between output terminals of said differentialinput circuit and the ground terminal.
 5. The semiconductor memorydevice according to claim 1, further comprising: a latch circuitoperative to latch said second differential output signals; and aselection switch operative to provide either data corresponding to datalatched in said latch circuit or inverted data of said latched data,based on the least significant signal in a row address for use inselection of said memory cells.
 6. The semiconductor memory deviceaccording to claim 1, further comprising a sensing circuit operative tosense at least one of said pair of first differential output signalsreaching a certain voltage and provide an activation signal, whereinsaid latch-type amplifier is operative to provide a pair of seconddifferential output signals based on the pair of first differentialoutput signals, when activated in accordance with said activationsignal, and said cutoff circuit is operative to break connection betweensaid differential input circuit and said latch-type amplifier inaccordance with said activation signal.